FAS Tech
Embedded
Products Overview
An embedded computer board, or built-in computer main board, is a compact and specialized computer platform designed to be integrated into various electronic devices and systems. These boards are intended to act as the brains of a variety of embedded applications, from industrial automation and medical equipment to vehicle control systems and IoT devices. They usually offer reliable and energy efficient performance and often have customizable I/O ports and support for specific tasks. Embedded computer cards are a key component in embedded technology and enable intelligent control and processing of data in a variety of contexts.
SBC 2.5"
2I110AW
11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU 1 x DDR4 SODIMM (Max. 32GB) Multiple Independent display: 4 x HDMI 3 x Intel 2.5 GbE LAN, 2 x USB 3.0 (type A), 4 x USB 2.0 2 x COM, 4DI / 4DO, 1 x Nano SIM 1 x M.2 B Key, 1 x M.2 M Key TPM 2.0, SMBus
2I110AW + Hailo-8™
11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU Pre-installed M.2 Hailo-8™ AI Accelerator 1 x DDR4 SODIMM (Max. 32GB) Multiple Independent display: 4 x HDMI 3 x Intel 2.5 GbE LAN, 2 x USB 3.0 (type A), 4 x USB 2.0 2 x COM, 4DI / 4DO, 1 x Nano SIM 1 x M.2 B Key, 1 x M.2 M Key TPM 2.0, SMBus
2I110D
11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU 1 x DDR4 SODIMM (Max. 32GB) Multiple Independent display: HDMI, eDP 4 x Intel GbE LAN, 3 x USB 3.0 (type A), 6 x USB 2.0 2 x COM, 4DI / 4DO, 1 x Nano SIM 1 x M.2 B Key, 1 x M.2 M Key TPM 2.0, SMBus
2I110D + Hailo-8™
11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU Pre-installed M.2 Hailo-8™ AI Accelerator 1 x DDR4 SODIMM (Max. 32GB) Multiple Independent display: HDMI, eDP 4 x Intel GbE LAN, 3 x USB 3.0 (type A), 6 x USB 2.0 2 x COM, 4DI / 4DO, 1 x Nano SIM 1 x M.2 B Key, 1 x M.2 M Key TPM 2.0, SMBus
2I640CW
Intel® Elkhart Lake ATOM® x6413E / J6412 CPU On Board LPDDR4 up to 8GB Independent display: 2 x HDMI (DP), 1 x eDP 2 x Intel 2.5 GbE LAN, 2 x USB 3.0, 5 x USB 2.0 4 x COM, 1 x Mini PCIe, 1 x M.2, 1 x Nano SIM, SMBus Touch Screen, 4DI / 4DO TPM 2.0
2I640DW + Hailo-8™
Intel® Elkhart Lake ATOM® x6413E / J6412 CPU Pre-installed M.2 Hailo-8™ AI Accelerator 1 x DDR4 SODIMM socket, Max. 32GB Independent display: 2 x HDMI (OEM to DP), 1 x eDP 3 x Intel 2.5 GbE LAN, 2 x USB 3.0, 3 x USB 2.0 2 x COM, 4DI / 4DO, 2 x M.2, 1 x Nano SIM TPM 2.0, SMBus
2I640HL + Hailo-8™
Intel® Elkhart Lake ATOM® x6413E / J6412 CPU Hailo-8™ edge AI processor 1 x DDR4 SODIMM socket, Max. 32GB Independent display: 2 x HDMI (1 x OEM to DP), 1 x eDP 3 x Intel 2.5 GbE LAN, 1 x USB 3.0, 5 x USB 2.0 2 x COM, 4DI / 4DO, 2 x M.2, 1 x Nano SIM TPM 2.0 (Firmware), SMBus
2I640HW
Intel® Elkhart Lake ATOM® x6413E / J6412 CPU On Board LPDDR4 up to 8GB Independent display: 1 x HDMI, 1 x LVDS, 1 x eDP 2 x Intel 2.5 GbE LAN, 1 x USB 3.0*, 5 x USB 2.0 1 x Mini PCIe, 1 x M.2, 1 x Nano SIM, 1 x PCIe x 2* 4 x COM, SMBus Touch Screen, HD Audio, 4DI / 4DO TPM 2.0
2I640HW + Hailo-8™
Intel® Elkhart Lake ATOM® x6413E / J6412 CPU On Board LPDDR4 up to 8GB Independent display: 1 x HDMI, 1 x LVDS, 1 x eDP 2 x Intel 2.5 GbE LAN, 1 x USB 3.0*, 5 x USB 2.0 1 x Mini PCIe, 1 x M.2, 1 x Nano SIM, 1 x PCIe x 2* 4 x COM, SMBus Touch Screen, HD Audio, 4DI / 4DO TPM 2.0
SBC 3.5"
JNF931
1. Intel® Gemini Lake/Gemini Lake-R SoC Processor (TDP 10W) 2. 2* DDR4 2400MHz SO-DIMM up to 8 GB 3. 1* 10/100/1000 Base-TX Ethernet Ports 4. 2* HDMI, 1* eDP support triple display 5. 1* COM, 2* USB3.1 (Gen.1), 4* USB2.0 6. 1* M.2 M-key (2242/2280)support NVMe, 1* M.2 E-key (2230 w/ CNVi) 7. 1* SATA III (6Gb/s), 32GB eMMC onboard (JNF931G32-4125)
MF04V0X
1. Intel® Elkhart Lake SoC Processor 2. 2* DDR4 3200MHz Dual Channel SO-DIMM up to 32GB 3. 2* Intel i225V 2.5GbE 4. 2* HDMI2.0b, 1* eDP (co-layout LVDS) 5. 2* COM, 3* USB3.1 (Gen.2), 5* USB2.0 6. 1* M.2 E-key 2230, 1* M.2 B-key 3042 W/SIM card slot 7. 1* M.2 M-key 2242/2280, 1* SATAIII (6Gb/s); 64GB eMMC (default) 8. Support 12~24V DC-in
MF04V3X
1. Intel® Elkhart Lake SoC Processor 2. 2* DDR4 3200MHz Dual Channel SO-DIMM up to 32GB 3. 2* Intel i225V 2.5GbE 4. 2* HDMI2.0b, 1* eDP (co-layout LVDS) 5. 2* COM, 3* USB3.1 (Gen.2), 5* USB2.0 6. 1* M.2 E-key 2230, 1* M.2 B-key 3042 W/SIM card slot 7. 1* M.2 M-key 2242/2280, 1* SATAIII (6Gb/s); 64GB eMMC (default) 8. Support 12~24V DC-in
MF05V
1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4-3200MHz SO-DIMM up to 64GB 3. 1* Intel® i219-LM 1.0GbE, 1* Intel i225-V 2.5GbE 4. 2* HDMI, 2* DisplayPort, 1* eDP, 1* LVDS 5. 4* COM (COM1/COM2 support RS232/422/485), 4* USB3.2 (Gen.2), 4* USB2.0 6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4 interface support NVME 7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi 8. 1* SATAIII (6Gb/s) 9. MF05V22 / MF05V92 : Onboard TPM 2.0 (option)